Customized substrate holder for Dual Ion Beam Sputtering (DIBS) applications.
- Engineering Services
- Vacuum Technology & Semiconductor Industry
- Development & Design
The Project
Initial Situation & Use
A substrate holder was required for a research coating system that could securely fix very thin substrates even at high rotational speeds.
It is used in a research and development environment with high demands on process stability and reproducibility.
Our Solution
G+P Engineering AG undertook the development and design of a customized substrate holder, tailored to the requirements of the DIBS process and the mechanical boundary conditions of the system.
Technical Specifications
- Application: Dual Ion Beam Sputtering (DIBS)
- Substrates: 6″, thickness 0.3 mm
- Rotational Speed: up to 1,000 min⁻¹
- Used in a coating system for Research & Development
Customer Benefits
- Secure fixation of thin substrates at high rotational speeds
- Reproducible coating processes
- Customized solution for research applications
